Release time：2023-09-22
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The 2023 China (Shenzhen) Integrated Circuit Summit (referred to as ICS2023 Summit) kicked off at 9:00 pm on September 21, 2023 at the JW Marriott Hotel in Bao'an, Shenzhen. This summit will last for two days.
The ICS2023 Summit, with the theme of "Insight into Core Trends and Building a Core Era Together", is guided by the China Semiconductor Industry Association and hosted by the Shenzhen Municipal People's Government in collaboration with the Integrated Circuit Design Branch of the China Semiconductor Industry Association and the National Science and Technology Major Special Overall Expert Group on "Nuclear High Base".
At the summit forum on the morning of 21st, Mao Junfa, academician of the CAS Member, Yu Shuhong, Fan Dianyuan, academician of the CAE Member and other well-known experts and scholars, leaders of government departments at all levels, entrepreneurs and industry elite representatives were specially invited to come together to discuss the high-quality development path of China's integrated circuit industry under the new situation in Shenzhen, a hot spot for innovation, cooperation and common development.
According to data, there are a total of 587 integrated circuit enterprises in Shenzhen, with a revenue of 160.89 billion yuan in the integrated circuit industry in 2022.
Zhang Lin, Secretary of the Party Group and Director of the Shenzhen Science and Technology Innovation Committee, stated in his speech at the summit that the 2023 China (Shenzhen) Integrated Circuit Summit is a very good opportunity to further leverage Shenzhen's advantages in the upstream design field of integrated circuits, rich downstream application scenarios, and high degree of market-oriented allocation of innovation elements, gather resources and forces from all aspects, comprehensively enhance core technology research capabilities, and focus on building a safe and stable industrial chain, Build an innovative city in all aspects and turn Shenzhen into a globally influential industrial innovation center.
Zhang Lin, Secretary and Director of the Party Group of Shenzhen Science and Technology Innovation Committee
Lian Cong, Deputy District Mayor of Bao'an District Government, stated in his speech that Bao'an District is a major and strong industrial area in Shenzhen. In 2022, the industrial output value of Bao'an District reached nearly trillion yuan, ranking fourth among the top 100 districts in China. Bao'an District is vigorously developing a large number of advanced manufacturing parks characterized by intelligent connected vehicles, intelligent manufacturing, laser equipment, etc., providing a rich industrial environment for the development of the semiconductor and integrated circuit industry. Bao'an District hopes to take advantage of this summit to discuss the development path of the integrated circuit industry with experts and scholars, continuously optimize the industrial environment, stimulate the momentum of technological development, and work together with industry leaders to accelerate the construction of a world-class advanced manufacturing highland.
Lian Cong, Deputy District Mayor of Bao'an District Government of Shenzhen City
Wang Junjie, Executive Secretary General of the China Semiconductor Industry Association, pointed out in his speech that the current global situation is "magnificent", and countries are seeking the great development of the semiconductor industry. In this situation, it is worth deeply considering how to jointly build industrial peace. The China Association for the Betterment of Trade Unions will continue to strengthen its linkage with local associations to better serve the industry.
Wang Junjie, Executive Secretary General of China Semiconductor Industry Association
Wei Shaojun, Chairman of the IC Design Branch of the China Semiconductor Industry Association and Professor of Tsinghua University, mentioned in his speech that the re globalization of the semiconductor industry chain and supply chain will be mainly based on cooperation, and China will undoubtedly firmly uphold economic globalization. As an important base for China's semiconductor industry, Shenzhen continues to develop and strengthen its industrial chain, promoting industrial chain upgrading and innovation capability enhancement.
Wei Shaojun, Chairman of the IC Design Branch of the China Semiconductor Industry Association and Professor at Tsinghua University
In order to promote the innovative development of integrated circuits in Shenzhen, the Shenzhen Semiconductor and Integrated Circuit Industry Alliance has been officially established, and the alliance was unveiled and awarded at today's summit forum. It is reported that the establishment of the Shenzhen Semiconductor and Integrated Circuit Industry Alliance is an important measure to implement the "20+8" industry "one cluster and one alliance" work deployment of the Shenzhen Municipal Party Committee and Government.
On site of the unveiling and awarding ceremony of the Shenzhen Semiconductor and Integrated Circuit Industry Alliance
Subsequently, Chen Wen, Director of the Science and Technology Major Special Office of the Shenzhen Science and Technology Innovation Committee, mentioned in the "Report on the Development of Shenzhen Integrated Circuit Industry" that Shenzhen is not only a key town in China's electronic information industry, but also a hub and design center for China's integrated circuit industry. In recent years, Shenzhen has adhered to innovation driven, comprehensive deployment and strengthening of basic research and key applied technology research, continuously improving its original innovation capabilities, adhering to systematic, gradient, and centralized research, and continuously enhancing its innovation hard power. In the future, Shenzhen will continue to strengthen its support for the integrated circuit industry, actively create a first-class business environment, and seize the opportunities of the era for the development of the integrated circuit industry.
Chen Wenwen, Director of the Science and Technology Major Special Office of Shenzhen Science and Technology Innovation Committee
Mao Junfa, academician of the CAS Member and president of Shenzhen University, pointed out in the theme sharing From Integrated Circuits to Integrated Systems that Moore's Law is facing extreme challenges, and integrated systems will be one of the important ways to "bypass" Moore's Law. Compared to integrated circuits, integrated systems have obvious advantages. Firstly, they are integrated across scales, materials, processes, dimensions, and physics; Secondly, top-level planning, collaborative design, and integrated manufacturing are carried out at the system level, greatly improving the efficiency of the entire design; Thirdly, using the same process to achieve higher performance.
Mao Junfa, academician of the CAS Member and president of Shenzhen University
"I think the most basic raw materials are very important, because the final application of all electronic components requires a substrate material, which often affects the tolerance, reliability, and application in different scenarios of all our electronic products." Yu Shuhong, an academician of the CAS Member and president of the Institute of Innovative Materials of South University of Science and Technology, said in the theme sharing of New Materials for Electronic Information Applications, We welcome all enterprises to fully utilize the infrastructure of the material genome and jointly promote innovation in the field of new materials, especially in the high-end electronics industry.
Yu Shuhong, Academician of the CAS Member and Dean of the Institute of Innovative Materials of South University of Science and Technology
Li Hong, President of China Resources Microelectronics Co., Ltd., mentioned in the theme sharing of "Aggregating Innovation and Application Advantages - Promoting High Quality Development of the Integrated Circuit Industry" that the key to the upward trend of the semiconductor industry lies in innovation driven, technological evolution and application. China Resources Microelectronics is committed to leveraging the advantages of the entire industry chain, using the IDM model to aggregate current innovative application advantages, and support the development of the integrated circuit industry in the Guangdong Hong Kong Macao Greater Bay Area, Support the differentiated and distinctive development of China's semiconductor industry.
Li Hong, President of China Resources Microelectronics Co., Ltd
Chen Wenhai, General Manager of the International Trading Center for Electronic Components and Integrated Circuits, stated in the theme sharing of "Empowering Efficient Trading, Assisting the Aggregation and Integration of Electronic Components and Integrated Circuits Supply Chain, and Cluster Development" that the trading center has initially planned three major models: user centralized procurement, aggregated bidding, and self-service matchmaking. The trading center hopes to build a trillion level international trading platform by widely gathering domestic and foreign resources, and become a dual circulation intersection between domestic and international markets.
Chen Wenhai, General Manager of Electronic Components and Integrated Circuit International Trading Center
Zhou Jianwei, General Manager of the Memory Business Unit of Huatian Technology (Nanjing) Co., Ltd., mentioned in the theme sharing of "Analysis of Advanced Memory Packaging Technology" that Memory is developing towards high integration and miniaturization, and memory packaging has increasingly high frequency requirements. Advanced packaging technology has become an important path to continue Moore's Law. As a leading domestic sealing and testing enterprise, Huatian Technology has formed a strong technological accumulation in the field of advanced memory packaging.
Zhou Jianwei, General Manager of the Memory Business Unit of Huatian Technology (Nanjing) Co., Ltd
Currently, Shenzhen is still strengthening its support for the integrated circuit industry and actively creating a first-class business environment. We hope to use the ICS2023 Summit to invite representatives of the government, enterprises, and universities to jointly explore the high-quality development path of the semiconductor industry, in order to promote communication and cooperation, achieve resource sharing and complementary advantages, and promote the high-quality development of the semiconductor and integrated circuit industries.
On the afternoon of the 21st, there was a wonderful lecture on the Automotive Chip and Third Generation Semiconductor Application Forum. Tomorrow, the ICS2023 Summit will have six thematic sub forums, focusing on topics such as RISC-V architecture and integrated circuit design, semiconductor manufacturing and advanced packaging, integrated development of the national "Core Fire" platform, data center chip applications, innovative ecological development of national microchip EDA, industry education integration innovation and investment, and continuing to explore breakthrough development paths and opportunities for the integrated circuit industry.
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